Temperature and Flux Effect on Contact Angles and Intermetallic Between Sn-8Zn-3Bi Lead-free Solder and Cu Substrate

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dc.creatorRamani Mayappan
dc.creatorZainal Arifin Ahmad
dc.date2023-11-06T09:08:48Z
dc.date2023-11-06T09:08:48Z
dc.date2009
dc.date.accessioned2024-10-21T02:36:17Z
dc.date.available2024-10-21T02:36:17Z
dc.identifier0126-6039
dc.identifierukmvital:12772
dc.identifierhttps://ptsldigital.ukm.my//jspui/handle/123456789/587872
dc.identifierSiri Q1.S23
dc.identifier.urihttps://repoemc.ukm.my/handle/123456789/17308
dc.languageen
dc.publisherPenerbit UKM
dc.relationSains Malaysiana
dc.relationhttp://journalarticle.ukm.my,http://www.ukm.my/jsm/
dc.subjectAntaralogam
dc.subjectfluks
dc.subjectpateri bebas Pb
dc.subjectSn-Zn-Bi
dc.subjectsudut sentuhan
dc.titleTemperature and Flux Effect on Contact Angles and Intermetallic Between Sn-8Zn-3Bi Lead-free Solder and Cu Substrate
dc.typeJournal Article

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